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Product Specification
108-40018
01Mar10 Rev E
AMP-LATCH* and IDC Header Connectors, .100 X .100 Inch Grid
1. 1.1. SCOPE Content This specification covers performance, tests and quality requirements for AMP-LATCH* universal and low profile, and IDC standard and low profile .100 X .100 inch grid headers, right angle and vertical assemblies. 1.2. Qualification When tests are performed on subject product line, procedures specified in Figure 1 shall be used. All inspections shall be performed using applicable inspection plan and product drawing. | | | 1.3. Successful qualification testing on the subject product line was completed on 03Nov95, additional testing was completed on 23Feb10. The Qualification Test Report number for this testing is 501-325. This documentation is on file at and available from Engineering Practices and Standards (EPS). APPLICABLE DOCUMENTS The following documents form a part of this specification to the extent specified herein. Unless otherwise specified, the latest edition of the document applies. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and referenced documents, this specification shall take precedence. | 2.1. Tyco Electronics Documents ! ! ! | | | | 3. 3.1. 2.3. 2.2. 109-1: Test Specification (General Requirements for Test Specifications) 109 Series: Test Specifications as indicated in Figure 1 501-325: Qualification Test Report (Connector, AMPLATCH* Header, .100 X .100 Inch Grid)
2.
Industry Document EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications Reference Document 109-197: Test Specification (Tyco Electronics Test Specifications vs EIA and IEC Test Methods) REQUIREMENTS Design and Construction Product shall be of design, construction and physical dimensions specified on applicable product drawing.
3.2.
Materials Materials used in the construction of this product shall be as specified on the applicable product drawing.
(c)2010 Tyco Electronics Corporation Harrisburg, PA All International Rights Reserved.
* Trademark | Indicates change
For latest revision, visit our website at www.tycoelectronics.com\documents. For Regional Customer Service, visit our website at www.tycoelectronics.com
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3.3. Ratings ! ! ! 3.4. Voltage: 250 volts AC Current: Signal application only, 1 ampere maximum per contact Temperature: -65 to 105C
Performance and Test Description Product is designed to meet electrical, mechanical and environmental performance requirements specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental conditions per Test Specification 109-1.
3.5.
Test Requirements and Procedures Summary Test Description Requirement Meets requirements of product drawing. ELECTRICAL Procedure Visual, dimensional and functional per applicable quality inspection plan. EIA-364-21. 500 volts DC, 2 minute hold. Test between adjacent contacts of unmated specimens.
Examination of product.
Insulation resistance.
5000 megohms minimum initial. 1000 megohms minimum final.
Withstanding voltage.
One minute hold with no breakdown EIA-364-20, Condition I. or flashover. 1000 volts AC at sea level. Test between adjacent contacts of unmated specimens. MECHANICAL Solderable area shall have minimum of 95% solder coverage. AMP Spec 109-11-1. Subject contacts to solderability for specimens with tin-lead plated soldertails. AMP Spec 109-11-11. Subject contacts to solderability for specimens with lead-free tin plated soldertails.
Solderability.
Component resistance to wave soldering.
See Note.
AMP Spec 109-202, Condition A. 240C for specimens with tin-lead plated soldertails. AMP Spec 109-202, Condition B. 265C for specimens with lead-free tin plated soldertails.
Contact retention.
Post shall not dislodge from normal EIA-364-29, Method A. position. Apply axial load of 2 pounds to contacts and hold for 6 seconds. See Figure 3. Figure 1 (continued)
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Test Description Thermal shock. See Note. Requirement ENVIRONMENTAL EIA-364-32, Test Condition II. Subject unmated specimens to 5 cycles between -65 and 105C with 30 minute dwells at temperature extremes. EIA-364-31, Method III. Subject unmated specimens to 10 cycles (10 days) between 25 and 65C at 80 to 100% RH with cold shock. Procedure
Humidity/temperature cycling.
See Note.
NOTE
Shall meet visual requirements, show no physical damage and shall meet requirements of additional tests as specified in Test Sequence in Figure 2. Figure 1 (end)
3.6.
Product Qualification and Requalification Test Sequence Test Group (a) Test or Examination Examination of product Insulation resistance Withstanding voltage Solderability Component resistance to wave soldering Contact retention Thermal shock Humidity/temperature cycling NOTE (a) (b) 2 4 4 5 2 1 1,3,5 2 1,3 3 1,8 2,6 3,7 Test Sequence (b)
See paragraph 4.1.A. Numbers indicate sequence in which tests are performed. Figure 2
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4. 4.1. QUALITY ASSURANCE PROVISIONS Qualification Testing A. Specimen Selection Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. All test groups shall each consist of a minimum of 5 headers of each type. B. Test Sequence Qualification inspection shall be verified by testing specimens as specified in Figure 2. 4.2. Requalification Testing If changes significantly affecting form, fit or function are made to the product or manufacturing process, product assurance shall coordinate requalification testing, consisting of all or part of the original testing sequence as determined by development/product, quality and reliability engineering. 4.3. Acceptance Acceptance is based on verification that the product meets the requirements of Figure 1. Failures attributed to equipment, test setup or operator deficiencies shall not disqualify the product. When product failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to confirm corrective action is required before resubmittal. 4.4. Quality Conformance Inspection The applicable quality inspection plan will specify sampling acceptable quality level to be used. Dimensional and functional requirements shall be in accordance with the applicable product drawing and this specification.
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AMP-LATCH Universal Header
AMP-LATCH Low Profile Header
IDC Standard Profile Header IDC Low Profile Header Figure 3 Contact Retention
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